SOC (Spin-on Carbon) is a class of coating materials used to reduce the step height of incoming topography in integrated circuit manufacturing. With its good flowability, it fully fills the trenches, holes and other patterns of the underlying layer, suppresses the step height caused by the previous layer and improves the exposure and patterning performance of the photoresist. It is suitable for high-resolution applications such as DRAM, advanced logic and 3D NAND, featuring excellent trench and hole filling capability and high etch selectivity.