Shanghai Winscene Technology Co., Ltd.

Product

Advanced Packaging / Optical Communications

SR Thermal-Curing High-Flexibility Solder Resist
SR Photosensitive High-Flexibility Solder Resist
LMC (Liquid Molding Compound)
CUF (Capillary Underfill)
COF Underfill

Semiconductor Photoresist

SOC
BARC
ArF
KrF
Micro Lens (Hard Mask & Underlayer)

Advanced Display

LTPR (Low-Temperature i-line Photoresist)
TFE Ink (Encapsulation Material)
BPDL (Pixel Definition Layer)
LTOC (Low-Temperature OC)
Array PR (i-line Photoresist)
PI (Alignment Layer)
NPFA (Negative Organic Insulating Film)
PPFA (Organic Insulating Film)
Fine PS (Photosensitive Spacer)
Normal PS (Photosensitive Spacer)
OC (Color-filter Overcoat)

CUF (Capillary Underfill)

CUF is a high-filler underfill with a low coefficient of thermal expansion. It effectively reduces solder joint stress and improves thermal cycling performance, and is especially suitable for flip-chip packaging applications such as FC-BGA and FC-CSP.